Overview

The Hyper NA SMI™ is a fourth generation tool that allows rapid measurement of lithographic tool illuminator characteristics using standard factory processing and metrology. With the SMI it is possible to generate a complete description of the quality of the lithographic tool illuminator and partial coherence.

The SMI product comprises an optical component in the same form factor as a standard reticle, and a software package for analyzing the data received from an image capture tool. The optical component is used to expose images of the pupil plane on a standard wafer. These images are made through exposure, and are then collected on a frame–grabbing image capture station. The images are then passed to the software for reconstruction of the intensity profile and the calculation of many illuminator system parameters.

	Advanced SMI	High Accuracy SMI	Hyper NA SMI™
Sigma Capability	NAILL max 0.75	NAILL max 0.95	NAILL max 1.30
NA Capability	NAPO max 0.95	NAPO max 0.95	NAPO max 1.37
Immersion Capability	No	No	Yes
Wavelength Capability	Multi wavelength 365 nm, 248 & 193 nm	Wavelength specific 365 nm, 248 nm, 193 nm	193 nm
Application	Above 130nm node	130nm node and below	90 nm node and below
Sigma Reproducibility	0.01	0.0075	0.0075
Spatial Resolution	1x	~10x	~10x
Effective Dose	1x	~0.1x	~0.005x
Key Features	Stepper / scanner compatibility ASML / Nikon / Canon cross platform capability	Stepper / scanner compatibility ASML / Nikon / Canon cross platform capability Complex source analysis capability	Up to 1.35 NA immersion capability Back compatible to non– immersion 193 nm lithography tools Complex source analysis capability ASML / Nikon / Canon cross platform capability

Features

• Resist based measurements
• Reticle design technology
• No moving or replacement parts
• Supports all OEM’s wavelengths
• Ability to be used within multi generations of OEM’s lithography tools
• Verification of off axis source performance, pole balance, source degradation, radiant intensity profiles, partial coherence.
• No calibration or maintenance required

Applications

• Correct design of RET masks (OPC, PSM etc.) requires consideration of the source profile
• Source variations in the pupil plane can give rise to feature imaging and placement errors

Benefits

• Reliable technology – can be used to calibrate OEM onboard sensor based metrology tools
• No calibration or maintenance required
• Meets two supplier strategy for matching sources by crossing platforms
• Match sigma, poles, etc. regardless of source design changes from OEM
• Provides full field across slit analysis and simulations for symmetry, ACLV, CD control, etc.
• Minimizes machine time, improves availability
• Solve printing problems, isolate root cause